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  june 2011 (hvm-1058-b) 1 < hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules CM750HG-130R z i c 750a z v ces 6500v z 1-element in a pack z high insulated type z lpt-igbt / soft recovery diode z alsic baseplate application traction drives, high reliability conv erters / inverters, dc choppers outline drawing & circuit diagram dimensions in mm
< hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules june 2011 2 maximum ratings symbol item conditions ratings unit v ge = 0v, t j = +125 c 6500 v ge = 0v, t j = +25c 6300 v ces collector-emitter voltage v ge = 0v, t j = ? 50c 5700 v v ges gate-emitter voltage v ce = 0v, t j = 25c 20 v i c dc, t c = 95c 750 a i crm collector current pulse (note 1) 1500 a i e dc 750 a i erm emitter current (note 2) pulse (note 1) 1500 a p tot maximum power dissipation (note 3) t c = 25c, igbt part 10400 w v iso isolation voltage rms, sinusoidal, f = 60hz, t = 1min. 10200 v v e partial discharge extinction volt age rms, sinusoidal, f = 60hz, q pd 10 pc 5100 v t j junction temperature ? 50 ~ +150 c t jop operating junction temperature ? 50 ~ +125 c t stg storage temperature ? 55 ~ +125 c t psc short circuit pulse width v cc = 4500 v, v ce v ces , v ge = 15v, t j = 125c 10 s electrical characteristics limits symbol item conditions min typ max unit t j = 25c ? ? 24.0 i ces collector cutoff current v ce = v ces , v ge = 0v t j = 125c ? 24.0 ? ma v ge(th) gate-emitter threshold voltage v ce = 10v, i c = 75ma, t j = 25c 5.8 6.3 6.8 v i ges gate leakage current v ge = v ges , v ce = 0v, t j = 25c ? 0.5 ? 0.5 a c ies input capacitance ? 136.0 ? nf c oes output capacitance ? 8.6 ? nf c res reverse transfer capacitance v ce = 10v, v ge = 0v, f = 100khz t j = 25c ? 4.0 ? nf q g total gate charge v cc = 3600v, i c = 750a, v ge = 15v ? 10.5 ? c t j = 25c ? 3.90 ? v cesat collector-emitter saturation voltage i c = 750a (note 4) v ge = 15v t j = 125c ? 4.80 5.60 v t j = 25c ? 1.20 ? t d(on) turn-on delay time t j = 125c ? 1.15 1.80 s t j = 25c ? 0.20 ? t r turn-on rise time t j = 125c ? 0.22 0.50 s t j = 25c ? 3.50 ? e on(10%) turn-on switching energy (note 5) t j = 125c ? 4.10 ? j t j = 25c ? 3.85 ? e on turn-on switching energy (note 6) v cc = 3600v i c = 750a v ge = 15v r g(on) = 3.9 l s = 150nh inductive load t j = 125c ? 4.80 ? j t j = 25c ? 7.30 ? t d(off) turn-off delay time t j = 125c ? 7.80 9.00 s t j = 25c ? 0.36 ? t f turn-off fall time t j = 125c ? 0.44 1.00 s t j = 25c ? 3.40 ? e off(10%) turn-off switching energy (note 5) t j = 125c ? 4.60 ? j t j = 25c ? 3.60 ? e off turn-off switching energy (note 6) v cc = 3600v i c = 750a v ge = 15v r g(off) = 33 l s = 150nh inductive load t j = 125c ? 4.90 ? j
< hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules june 2011 3 electrical characteristics (continuation) limits symbol item conditions min typ max unit t j = 25c ? 3.00 ? v ec emitter-collector voltage (note 2) i e = 750a (note 4) v ge = 0v t j = 125c ? 3.20 3.80 v t j = 25c ? 0.55 ? t rr reverse recovery time (note 2) t j = 125c ? 0.75 ? s t j = 25c ? 900 ? i rr reverse recovery current (note 2) t j = 125c ? 1000 ? a t j = 25c ? 750 ? q rr reverse recovery charge (note 2) t j = 125c ? 1100 ? c t j = 25c ? 1.05 ? e rec(10%) reverse recovery energy (note 2)(note 5) t j = 125c ? 1.85 ? j t j = 25c ? 1.40 ? e rec reverse recovery energy (note 2)(note 6) v cc = 3600v i c = 750a v ge = 15v r g(on) = 3.9 l s = 150nh inductive load t j = 125c ? 2.10 ? j thermal characteristics limits symbol item conditions min typ max unit r th (j -c ) q junction to case, igbt part ? ? 12.0 k/kw r th (j -c ) d thermal resistance junction to case, fwdi part ? ? 22.0 k/kw r th ( c-s ) contact thermal resistance case to heat sink, g rease = 1w/m k, d ( c-s ) = 100 m ? 6.0 ? k/kw mechanical characteristics limits symbol item conditions min typ max unit m t m : main terminals screw 7.0 ? 22.0 nm m s m : mounting screw 3.0 ? 6.0 nm m t mounting torque m : auxiliary terminals screw 1.0 ? 3.0 nm m mass ? 1.4 ? kg cti comparative tracking index 600 ? ? ? d a clearance 26.0 ? ? mm d s creepage distance 56.0 ? ? mm l p ce parasitic stray inductance ? 15.0 ? nh r cc?+ee? internal lead resistance tc = 25c ? 0.18 ? m r g internal gate resistance tc = 25c ? 2.6 ? note1. pulse width and repetition rate shoul d be such that junction temperature (t j ) does not exceed topmax rating. 2. the symbols represent characteri stics of the anti-parallel, emitte r to collector free-wheel diode (fwd i ). 3. junction temperature (t j ) should not exceed t jmax rating (150c). 4. pulse width and repetition rate should be such as to cause negligible temperature rise. 5. e on(10%) / e off(10%) / e rec(10%) are the integral of 0.1v ce x 0.1i c x dt. 6. definition of all items is according to iec 60747, unless otherwise specified.
< hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules june 2011 4 performance curves output characteristics (typical) 0 250 500 750 1000 1250 1500 02468 collector - emitter voltage [v] collector current [a] v ge = 10v v ge = 11v v ge = 15v v ge = 13v t j = 125c collector-emitter saturation voltag e characteristics (typical) 0 250 500 750 1000 1250 1500 02468 collector-em itter saturation voltage [v] collector current [a] v ge = 15v t j = 125c t j = 25c transfer characteristics (typical) 0 250 500 750 1000 1250 1500 0 4 8 12 16 gate - em itter voltage [v] collector current [a] t j = 25c v ce = v ge t j = 125c free-wheel diode forward characteristics (typical) 0 250 500 750 1000 1250 1500 012345 emitter-collector voltage [v] emitter current [a] t j = 25c t j = 125c
< hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules june 2011 5 performance curves capacitance characteristics (typical) 1 10 100 1000 0.1 1 10 100 collector-emitter voltage [v] capacitance [nf] c ies v ge = 0v, t j = 25c f = 100khz c oes c res half-bridge switching energy characteristics (typical) 0 2 4 6 8 10 12 14 0 250 500 750 1000 1250 1500 collector current [a] switching energies [j] v cc = 3600v, v ge = 15v r g(on) = 3.9 ? , r g(off) = 33 ? l s = 150nh, t j = 125c inductive load e off e on e rec gate charge characteristics (typical) -15 -10 -5 0 5 10 15 20 024681012 gate charge [c] gate-emitter voltage [v] v ce = 3600v, i c = 750a t j = 25c half-bridge switching energy characteristics (typical) 0 2 4 6 8 10 12 0246810 gate res is tor [ohm ] switching energies [j] e rec v cc = 3600v, i c = 750a v ge = 15v, l s = 150nh t j = 125c, inductive load e on
< hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules june 2011 6 performance curves half-bridge switching energy characteristics (typical) 0 2 4 6 8 10 12 0 1020304050 gate res is tor [ohm ] switching energies [j] v cc = 3600v, i c = 750a v ge = 15v, l s = 150nh t j = 125c, inductive load e off free-wheel diode reverse recovery characteristics (typical) 0.1 1 10 100 100 1000 10000 emitter current [a] reverse recovery time [s] 10 100 1000 10000 reverse recovery current [a] t rr i rr v cc = 3600v, v ge = 15v r g(on) = 3.9 ? , l s = 150nh t j = 125c, inductive load half-bridge switching time characteristics (typical) 0.01 0.1 1 10 100 100 1000 10000 collector current [a] switching times [s] v cc = 3600v, v ge = 15v r g(on) = 3.9 ? , r g(off) = 33 ? l s = 150nh, t j = 125c inductive load t r t d(on) t d(off) t f reverse bias safe operating area (rbsoa) 0 500 1000 1500 2000 2500 0 2000 4000 6000 8000 collector-emitter voltage [v] collector current [a] v cc 4500v, v ge = 15v t j = 125c, r g(off) = 33 ?
< hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules june 2011 7 performance curves short circuit safe operating area (scsoa) 0 2 4 6 8 10 0 2000 4000 6000 8000 collector-emitter voltage [v] collector current [ka] v cc 4500v, v ge = 15v t j = 125c, r g(on) = 3.9 ? , r g(off) = 33 ? transient thermal impedance characteristics 0 0.2 0.4 0.6 0.8 1 1.2 0.001 0.01 0.1 1 10 tim e [s ] normalized transient thermal impedance r th(j-c)q = 12.0k/kw r th(j-c)d = 22.0k/kw free-wheel diode reverse recovery safe operating area (rrsoa) 0 500 1000 1500 2000 2500 0 2000 4000 6000 8000 emitter-collector voltage [v] reverse recovery current [a] v cc 4500v, di/dt < 4.5ka/ s t j = 125c ? ? ? ? ? ? ? ? ? ? = ? ? ? ? ? ? ? ? ? ? = ? exp 1 r z i t n 1 i i ) c j ( th ) t ( 1234 r i [k/kw] : 0.0055 0.2360 0.4680 0.2905 t i [sec] : 0.0001 0.0131 0.0878 0.6247
< hvigbt modules > CM750HG-130R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules june 2011 8 ? 2011 mitsubishi electric corporation. all rights reserved. keep safety first in your circuit designs! mitsubishi electric corporation puts the maximum effo rt into making semiconductor products better and more reliable, but there is alwa ys the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appr opriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials ?these materials are intended as a reference to assist our customers in the selection of the mitsubishi semiconductor product best suited to the customer?s application; they do not convey any license under any intellectual property rights, or any ot her rights, belonging to mitsubishi elec tric corporation or a third party. ?mitsubishi electric corporation assumes no res ponsibility for any damage, or infringement of any third-party?s rights, originating in the use of any pr oduct data, diagrams, charts, programs, algorithms, or circuit application examples c ontained in these materials. ?all information contained in thes e materials, including product data, diagrams, charts, programs and algorithms represents information on pr oducts at the time of publication of these materials, and are subject to change by mitsubishi electric cor poration without notice due to product improvements or other reasons. it is therefore recommended that cust omers contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distri butor for the latest product info rmation before pu rchasing a product listed herein. the information described here may contain technica l inaccuracies or typographical errors. mitsubishi electric corporation assumes no re sponsibility for any damage, liability, or other loss rising from these inaccuracies or errors. please also pay attention to info rmation published by mitsubishi electr ic corporation by various means, including the mitsubishi semiconductor home page (http://www. m itsubishielectric.com/). ?when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, pleas e be sure to evaluate all informati on as a total system before making a final decision on the applic ability of the information and products. mi tsubishi electric corporation assumes no responsibility for any damage, liabilit y or other loss resulting from the information contained herein. ?mitsubishi electric corporation semiconductors are not designed or m anufactured for use in a device or system that is used under circum stances in which human life is pot entially at stake. please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor when considering the use of a pr oduct contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aeros pace, nuclear, or undersea repeater use. ?the prior written approval of mitsubishi electric corporat ion is necessary to reprint or reproduce in whole or in part these materials. ?if these products or technologies ar e subject to the japanese export cont rol restrictions, they must be exported under a license from the ja panese government and cannot be im ported into a country other than the approved destination. any diversion or re-export contrary to the export contro l laws and regulations of japan and/or the country of destination is prohibited. ?please contact mitsubishi electric corporation or an authorized mitsubi shi semiconductor product distributor for further details on these material s or the products contained therein.


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